Gold Tin Solder Paste, Flux Free (AuSn) 80-100nm, 99.9%
Sold per Gram. MOQ = 1g.
Gold Tin Solder Paste, Flux Free (AuSn) 80-100nm, 99.9%
| Material class | Mixed Metal Alloys |
|---|---|
| Sub-category | Gold Paste |
| Shape | Spherical |
| Density | Sn20/Au80 = 7.4 g/cc Sn25/Au75 = 7.4 g/cc |
| Composition | Sn20/Au80 |
| Solder Paste | Metal Content |
| Melting Point | Sn20/Au80 = 217°C Sn25/Au75 = 217°C |
| Minimum Pitch | 16 mil (400 microns) |
| Particle Size | 80-100nm |
| NS6130-01-157/1 | Alloy |
| 3.99 ± 0.2 g/ml | Performance Properties |
| Standard 89% ± 1% | Viscosity Range |
| Typical Print Thickness | 0.4 – 0.65 mm pitch: 150 microns <0.4 mm pitch: 120 microns |
| 130 ± 40 Pas Physica CSS 10 s-1 | Density |
| Minimum Pad Width Quantities INSCX Thematic | 8 mil (200µm, Stencil Thickness -150 µm 5Gms, 10Gms + Metal Alloys |
| Gold Tin Solder Paste, Flux free (AuSn), 80-100nm, 99.9% | Indication |
| Sn20/Au80 (Standard) Sn25/Au75 (upon request) Other alloys are available on request | Physical Properties |
Order
£450.00 /g
£450.00/g
Settled via NetCash®. Pricing confirmed by the settlement desk before invoicing.